Double color micro led display panel

ABSTRACT

The present invention discloses a double color micro LED display panel including a plurality of pixels. Each of the pixels includes a substrate, a first semiconductor layer configured on the substrate, a second semiconductor layer configured on the first semiconductor layer, and a third semiconductor layer configured between the first semiconductor layer and the second semiconductor layer. The first semiconductor layer and the second semiconductor layer are P type, and the third semiconductor layer is N type. The first semiconductor layer and the third semiconductor layer form a first light emitting diode to emit a first light, and the second semiconductor layer and the third semiconductor layer form a second light emitting diode to emit a second light.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a display panel, and more particularly,to a double color micro LED display panel including two light emittingdiodes which emit lights with different colors in one pixel.

2. Description of the Prior Art

In recent years, Mini LED and Micro LED technologies have been welldeveloped, and LED panels are commonly applied to consumer devices andapplications such as augmented reality (AR), projection, heads updisplay (HUD), and mobile device displays, wearable device displays, andautomotive displays. With the improvement of people's quality of life,the devices and applications require LED panels with improved resolutionand brightness. For example, an AR display integrated within a goggleand positioned close to a wearer's eyes can have a dimension of thefingernail while still demanding an HD definition (1280×720 pixels) orhigher.

With the requirement for miniaturization and portability of electronicdevices, the size of the LED panels is also limited. It means that thesize of each pixel of the LED panel is decreased when the LED panel hashigh resolution. When the size of the pixel is smaller, the light outputarea of the pixel is also decreased. Moreover, light is emitted inmultiple directions, so the pixel can only emit part of the light,thereby reducing the light output rate. Furthermore, the distance amongthe pixels is also decreased when the LED panel has high resolution.That is to say, the light emitted from one pixel is easier to transmitto another pixel of the LED panel to cause the light crosstalk, therebydecreasing the display efficiency.

In addition, it is increasingly important for a light emitting device tointegrate a plurality of various types of light emitting transistors andmulti-color light emitting pixel units. In the prior art, themulti-color light emitting pixel includes a plurality of light emittingregions for emitting different types of lights respectively. Because thealigning processes and transferring processes are complex, theconventional process of fabricating the different types of lightemitting regions becomes increasingly difficult, thereby leading toproblems such as decreased alignment accuracy, decreased yield, andincreased cost.

Generally speaking, at least red, green and blue colors are superimposedto reproduce a broad array of colors. In some instances, the pixelincludes three monochromatic LEDs emitting red, green and blue colorsrespectively, and the monochromatic LEDs are fabricated at differentnon-overlapping zones in the pixel. The existing technology faces thechallenges to improve the effective emitting area within each pixel whenthe distance between the adjacent LEDs is determined. On the other hand,when a single LED emitting area is determined, further improving theoverall resolution of the LED panel can be a difficult task because LEDswith different colors have to occupy their designated zones within thesingle pixel.

Thus, it is necessary to provide an LED structure for display panels tosolve the above-mentioned drawbacks.

SUMMARY OF THE INVENTION

Therefore, the present invention is to provide a double color micro LEDdisplay panel including a plurality of pixels. Each of the pixelsincludes a substrate, a first semiconductor layer, a secondsemiconductor layer and a third semiconductor layer. The firstsemiconductor layer is configured on the substrate, the secondsemiconductor layer is configured on the first semiconductor layer, andthe third semiconductor layer is configured between the firstsemiconductor layer and the second semiconductor layer. The firstsemiconductor layer and the second semiconductor layer are P type, andthe third semiconductor layer is N type. The first semiconductor layerand the third semiconductor layer form a first light emitting diode toemit a first light, and the second semiconductor layer and the thirdsemiconductor form a second light emitting diode to emit a second light.

Wherein, the wavelength of the first light is different from that of thesecond light.

Furthermore, the first light and the second light are selected from twoof red, blue, yellow, green, orange, cyan and purple lights.

Wherein, each of the pixels includes an insulation layer. The insulationlayer covers the top surface and side wall of the second semiconductorlayer, the side wall of the first semiconductor layer and the thirdsemiconductor layer, and the surface of the substrate. A portion of thethird semiconductor layer is exposed from the insulation layer, and theinsulation layer extends to the position between two of the pixels.

Wherein, each of the pixels includes a top conductive layer configuredon the insulation layer and electrically connected to the exposed thirdsemiconductor layer. The conductive layer extends to the positionbetween two of the pixels.

Wherein, the double color micro LED display panel further includes aplurality of first conductive pads respectively configured on the topconductive layer between two of the pixels and electrically connected tothe third semiconductor layer through the top conductive layer.

In one embodiment, the double color micro LED display panel furtherincludes a plurality of reflective components respectively disposed onthe first conductive pads and configured to reflect the first light andthe second light to a certain direction.

In one embodiment, the double color micro LED display panel furtherincludes a plurality of optical isolation components respectivelydisposed on the first conductive pads and configured to block the firstlight and the second light emitted from one of the pixels to the otherof the pixels.

Wherein, each of the pixels includes a second conductive pad and a firstconnecting structure. The second conductive pad is configured on thesubstrate, and the first connecting structure is electrically connectedto the second semiconductor layer and the second conductive pad.

Wherein, each of the pixels includes a third conductive pad configuredon the substrate and a bonding layer configured between the substrateand the first semiconductor layer. The bonding layer is electricallyconnected to the first semiconductor layer and the third conductive pad.

Furthermore, the double color micro LED display panel further includes aplurality of pixels drivers respectively configured on the substrate ofthe pixels. The pixel driver is electrically connected to the secondconductive pad and the third conductive pad and controls the first lightemitting diode and the second light emitting diode to emit lightsrespectively.

In one embodiment, the double color micro LED display panel furtherincludes a plurality of first conductive pads respectively coupled tothe third semiconductor layer of the pixels and a plurality of pixeldrivers respectively configured on the substrate of the pixels. Thepixel driver is electrically connected to the first conductive pad, thesecond conductive pad and the third conductive pad, and the pixel drivercontrols the first light emitting diode and the second light emittingdiode to emit lights respectively.

In one embodiment, the double color micro LED display panel furtherincludes a plurality of reflective components respectively disposed onthe insulation layer between two of the pixels and configured to reflectthe first light and the second light to a certain direction.

In one embodiment, the double color micro LED display panel furtherincludes a plurality of optical isolation components respectivelydisposed on the insulation layer between two of the pixels andconfigured to block the first light and the second light emitted fromone of the pixels to the other of the pixels.

In one embodiment, each of the pixels includes a first conductive pad, asecond conductive pad, a first connecting structure and a secondconnecting structure. The first conductive pad and the second conductivepad are configured on the substrate. The first connecting structure iselectrically connected to the second semiconductor layer and the secondconductive pad, and the second connecting structure is electricallyconnected to the third semiconductor layer and the first conductive pad.

Wherein, each of the pixels includes a third conductive pad configuredon the substrate and a bonding layer configured between the substrateand the first light emitting diode. The bonding layer is electricallyconnected to the first semiconductor layer and the third conductive pad.

Furthermore, the double color micro LED display panel further includes aplurality of pixel drivers respectively configured on the substrate ofthe pixels. The pixel driver is electrically connected to the firstconductive pad, the second conductive pad and the third conductive pad,and the pixel driver controls the first light emitting diode and thesecond light emitting diode to emit lights respectively.

Wherein, the area of the first light emitting diode is larger than thatof the second light emitting diode.

In summary, the double color micro LED display panel of the presentinvention can include two light emitting diodes which emit differentcolors in one pixel, thereby increasing the light emitting efficiencyand reducing the volume. The reflective component and the opticalisolation component can effectively block the light emitted from onepixel to another of pixels to reduce the light crosstalk, therebyincreasing the display efficiency and the resolution. Moreover, thereflective component can reflect the lights to increase the light outputrate, which improves the display efficiency.

BRIEF DESCRIPTION OF THE APPENDED DRAWINGS

FIG. 1 is a schematic diagram illustrating a double color micro LEDdisplay panel according to an embodiment of the present invention.

FIG. 2 is a cross-sectional diagram illustrating the two pixels of thedouble color micro LED display panel in FIG. 1.

FIG. 3 is a cross-sectional diagram illustrating the two pixels of thedouble color micro LED display panel according to another embodiment ofthe present invention.

FIG. 4 is a top view diagram illustrating the two pixels of the doublecolor micro LED display panel in FIG. 3.

FIG. 5 is a cross-sectional diagram illustrating the two pixels of thedouble color micro LED display panel according to the embodiment of FIG.2.

FIG. 6 is a cross-sectional diagram illustrating the two pixels of thedouble color micro LED display panel according to the embodiment of FIG.2.

FIG. 7 is a cross-sectional diagram illustrating the two pixels of thedouble color micro LED display panel according to another embodiment ofthe present invention.

FIG. 8 is a cross-sectional diagram illustrating the two pixels of thedouble color micro LED display panel according to the embodiment of FIG.7.

FIG. 9 is a cross-sectional diagram illustrating the two pixels of thedouble color micro LED display panel according to the embodiment of FIG.7.

FIG. 10 is a cross-sectional diagram illustrating the two pixels of thedouble color micro LED display panel according to another oneembodiment.

DETAILED DESCRIPTION OF THE INVENTION

A detailed description of the hereinafter described embodiments of thedisclosed apparatus and method are presented herein by way ofexemplification and not limitation with reference to the Figures.Although certain embodiments are shown and described in detail, itshould be understood that various changes and modifications may be madewithout departing from the scope of the appended claims. The scope ofthe present invention will in no way be limited to the number ofconstituting components, the materials thereof, the shapes thereof, therelative arrangement thereof, etc., and are disclosed simply as anexample of embodiments of the present invention.

Please refer to FIG. 1 and FIG. 2. FIG. 1 is a schematic diagramillustrating a double color micro LED display panel 1 according to anembodiment of the present invention. FIG. 2 is a cross-sectional diagramillustrating the two pixels 11 of the double color micro LED displaypanel 1 in FIG. 1. In this embodiment, the double color micro LEDdisplay panel 1 includes a plurality of pixels 11. Each of the pixels 11includes a substrate 110, a first semiconductor layer 111, a secondsemiconductor layer 112 and a third semiconductor layer 113. The firstsemiconductor layer 111 is configured on the substrate 110, the secondsemiconductor layer 112 is configured on the first semiconductor layer111, and the third semiconductor layer 113 is configured between thefirst semiconductor layer 111 and the second semiconductor layer 112.The first semiconductor layer 111 and the second semiconductor layer 112are P type, and the third semiconductor layer 113 is N type. The firstsemiconductor layer 111 and the third semiconductor layer 113 form afirst light emitting diode 11A to emit a first light, and the secondsemiconductor layer 112 and the third semiconductor layer 113 form asecond light emitting diode 11B to emit a second light.

In practice, the double color micro LED display panel 1 can be appliedto the screens of display devices. The plurality of pixels 11 of thedouble color micro LED display panel 1 can be arranged in an array. Thefirst semiconductor layer 111, the third semiconductor layer 113 and thesecond semiconductor layer 112 are sequentially stacked on the substrate110. For convenience, “top” means away from the substrate 110, “bottom”means toward the substrate 110, and the directional terms such as up,down, above, below, under etc. are interpreted accordingly.

The first semiconductor layer 111, the second semiconductor layer 112and the third semiconductor layer 113 can be epitaxial layers formed byepitaxial growth, such as chemical vapor deposition (CVD), vapor phaseepitaxy (VPE), liquid phase epitaxy (LPE) or solid phase epitaxy (SPE).Moreover, the first semiconductor layer 111 and the second semiconductorlayer 112 can be P type epitaxial layers, and the third semiconductorlayer 113 can be N type epitaxial layers. Therefore, the firstsemiconductor layer 111 and the third semiconductor layer 113 form thefirst light emitting diode 11A, and the second semiconductor layer 112and the third semiconductor layer 113 form the second light emittingdiode 11B. It means that the first light emitting diode 11A and thesecond light emitting diode 11B share the same N type semiconductorlayer. Furthermore, the first light emitting diode 11A is located at thebottom of the pixel 11, and the second light emitting diode 11B islocated at the top of the pixel 11. In one embodiment, the pixel 11further includes a first multiple quantum well layer (MQW) and a secondMQW layer (not shown in the figure). The first MQW layer is disposedbetween the first semiconductor layer 111 and the third semiconductorlayer 113, and the second MQW layer is disposed between the secondsemiconductor layer 112 and the third semiconductor layer 113. Inpractice, the first MQW layer and the second MQW layer also can beepitaxial layers by epitaxial growth, to increase the light strength ofthe first light and the second light emitted from the first lightemitting diode 11A and the second light emitting diode 11B.

In practice, the substrate 110 can be, but not limited to, a Sisubstrate, and the substrate 110 also can be a sapphire substrate, or atransparent substrate such as a glass substrate. The material of thesubstrate 110 also may be selected from one of InP, SiC and ZnO. Thematerial of the first semiconductor layer 111, the second semiconductorlayer 112 and the third semiconductor layer 113 can be GaN, AlGaN,AlInGaN, GaP, GaAs, but it is not limited herein. The first lightemitted from the first light emitting diode 11A and the second lightemitted from the second light emitting diode 11B can be selected from arange of different colors from a wavelength of 380 nm to 700 nm invisible color range. Furthermore, the first light and the second lightcan be selected from two of red, blue, yellow, green, orange, cyan andpurple lights. For example, the first semiconductor layer 111 is P typeGaN layer to emit blue light, the second semiconductor layer 112 is Ptype GaN layer to emit green light, and the third semiconductor layer113 is N type GaN layer. Therefore, the first light emitting diode 11Acan emit blue light and the second light emitting diode 11B can emitgreen light. Moreover, the first light and the second light also can beselected from invisible ranges such as ultra-violet and infrared.

In this embodiment, the cross-sectional area of the first semiconductorlayer 111, the third semiconductor layer 113 and the secondsemiconductor layer 112 decreases from the bottom layer to the toplayer. In practice, the configuration of those layers of the pixel 11will improve the electronic connections between the individual LEDstructures and the electrodes, which simplifies the fabrication process.For example, the lower layer is exposed from the upper layer for easyconnection. Moreover, the area of the first light emitting diode 11A canbe larger than that of the second light emitting diode 11B. It meansthat the second light emitting diode 11B only covers a part of the firstlight emitting diode 11A. Therefore, the other uncovered portion of thefirst light emitting diode 11A can emit the first light directly,thereby increasing the light output rate.

In this embodiment, the pixel 11 further includes an insulation layer116. The insulation layer 116 covers the top surface and side wall ofthe second semiconductor layer 112, the side wall of the firstsemiconductor layer 111 and the third semiconductor layer 113, and thesurface of the substrate 110. Furthermore, a portion of thirdsemiconductor layer 113 is exposed from the insulation layer 116, andthe insulation layer 116 also extends to the position between two of thepixels. In practice, the material of the insulation layer 116 can bedielectric thin-film materials such as SiNx and SiO2, or polymericmaterial such as polyamide (PA). Furthermore, the insulation layer 116may be transparent. The insulation layer 116 can be formed on the pixel11 by pasting, coating or CVD. Therefore, the insulation layer 116prevents the semiconductor layer 111, the second semiconductor layer 112and the third semiconductor layer 113 from causing a short circuit. Theexposed portion of the third semiconductor layer 113 can be formed byetching the insulation layer 116. Furthermore, as shown in FIG. 2, theexposed portion can be the top surface of the third semiconductor layer113. In practice, the exposed portion can be formed by etching thesecond light emitting layer 112 and part of the third semiconductorlayer 113 as a stair shape, then disposing the insulation layer 116 onthe layers, and then removing the insulation layer 116 located on theexposed portion of the third semiconductor layer 113.

In this embodiment, the pixel 11 further includes a top conductive layer117. The top conductive layer 117 is configured on the insulation layer116, and extends to the position between the pixels 11. In practice, thematerial of the top conductive layer 117 can be Indium Tin Oxide (ITO),and the top conductive layer 117 can be formed on the insulation layer116 commonly by vapor deposition. Furthermore, the top conductive layer117 may be transparent. The top conductive layer 117 is configured tomaintain a good conductivity for electrode connection. In thisembodiment, when the top conductive layer 117 is disposed on the pixel11, the top conductive layer 117 contacts and electrically connects tothe exposed portion of the third semiconductor layer 113. Furthermore,the top conductive layer 117 can connect the exposed portion of thethird semiconductor layer 113 of all pixels in series. It should benoted that the insulation layer 116 and the top conductive layer 117 notonly cover two pixels 11 in FIG. 2, but also can extend to cover otherpixels.

In this embodiment, the double color micro LED display panel 1 includesa plurality of first conductive pads 141, and each of the pixelsincludes a second conductive pad 142 and a first connecting structure115. The first conductive pads 141 are respectively configured on thetop conductive layer 117 between two of the pixels and electricallyconnected to the third semiconductor layer 113 through the topconductive layer 117. The second conductive pad 142 is configured on thesubstrate 110. The first connecting structure 115 is electricallyconnected to the second semiconductor layer 112 and the secondconductive pad 142. In practice, the first connecting structure 115 canbe made of conductive material. Furthermore, the material of the firstconnecting structure 115 also may be Indium Tin Oxide (ITO). As shown inFIG. 2, the first connecting structure 115 can be connected to the topsurface of the second semiconductor layer 112. The first conductive pads141 is an N-electrode, and the second conductive pad 142 is aP-electrode. When the second conductive pads 142 and the firstconductive pad 141 receive the electricity, the electricity can passthrough the second semiconductor layer 112 and the third semiconductorlayer 113 via the top conductive layer 117 and the first connectingstructure 115, so that the second light emitting diode 11B formed by thesecond semiconductor layer 112 and the third semiconductor layer 113 canemit the second light.

In this embodiment, each of the pixels further includes a thirdconductive pad 143 and a bonding layer 118. The third conductive pad 143is configured on the substrate 110. The bonding layer 118 is configuredbetween the substrate 110 and the first semiconductor layer 111 andelectrically connected to the first semiconductor layer 111 and thethird conductive pad 143. In practice, the bonding layer 118 can be ametal layer, and the material of the bonding layer 118 can comprise atleast one selected from Au, Sn, In, Ti and Cu. Hence, the thirdconductive pad 143 can be electrically connected to the firstsemiconductor layer 111 through the bonding layer 118. Moreover, thethird conductive pad 143 is a P-electrode. When the first conductive pad141 and the third conductive pad 143 receive the electricity, theelectricity can pass through the first semiconductor layer 111 and thethird semiconductor layer 113 via the top conductive layer 117 and thebonding layer 118, so that the first light emitting diode 11A formed bythe first semiconductor layer 111 and the third semiconductor layer 113can emit the first light. Therefore, the first emitting diode and thesecond emitting diode can be formed in one pixel of the double colormicro LED display panel, and the first emitting diode and the secondemitting diode can share the same semiconductor layer, therebyincreasing the light emitting efficiency and reducing volume.

The bonding layer is not limited to the metal layer, the bonding layeralso can be a non-metallic layer. In one embodiment, the bonding layeris a non-metallic layer and the pixel further includes a conductivelayer (not shown in figure). The conductive layer is disposed betweenthe bonding layer and the first semiconductor layer, and the conductivelayer is electrically connected to the third conductive pad. Inpractice, the conductive layer may include conductive material andconnect to the third conductive pad through metal wire or plate.Therefore, the electricity also can pass from the third conductive padto the first semiconductor layer.

In this embodiment, the double color micro LED display panel 1 furtherincludes a plurality of pixel drivers 15 respectively configured on thesubstrate 110 of the pixels 11. The pixel driver 15 connects to thefirst conductive pad 141, the second conductive pad 142 and the thirdconductive pad 143. In practice, the pixel driver 15 can be acontrolling chip. The pixel driver 15 can be connected to a power sourceto receive the electricity of the power source. Furthermore, the pixeldriver 15 can selectively apply the electricity to the first conductivepad 141, the second conductive pad 142 and the third conductive pad 143to control the first light emitting diode 11A and the second lightemitting diode 11B to emit lights. For example, when the pixel driver 15applies a forward bias to the first conductive pad 141 and the secondconductive pad 142, and to the first conductive pad 141 and the thirdconductive pad 143, the first light emitting diode 11A and the secondlight emitting diode 11B emit the first light and the second light atthe same time. When the pixel driver 15 applies a forward bias to thefirst conductive pad 141 and the second conductive pad 142 and applies areserve bias to the first conductive pad 141 and the third conductivepad 143, the pixel 11 only emits the second light. Therefore, the doublecolor micro LED display panel 1 can emit at least one light according todifferent power configurations.

The configuration of the pixel also can be another form. Please refer toFIG. 3 and FIG. 4. FIG. 3 is a cross-sectional diagram illustrating thetwo pixels 11′ of the double color micro LED display panel according toanother embodiment of the present invention. FIG. 4 is a top viewdiagram illustrating the two pixels 11′ of the double color micro LEDdisplay panel in FIG. 3. In this embodiment, the first conductive pad141′ is configured on the exposed portion of the third semiconductorlayer 113′ directly. Furthermore, the top conductive layer 117′ does notconnect to the third semiconductor layer 113′ and does not extend to thetop conductive layer 117′ of another pixels 11′. In practice, the firstconductive pad 141′ can be connected to the top conductive layer 117′ byconductive component (not shown in the figure), and then the pixeldriver 15′ connects the top conductive layer 117′, the second conductivepad 142′ and the third conductive pad 143′ to control the first lightemitting diode and the second light emitting diode to emit lights. Inthis embodiment, each of pixel drivers 15′ respectively control singlepixel 11′ of the double color micro LED display panel. In oneembodiment, the pixel driver connects the second conductive pad and thethird conductive pad, the top conductive layer connects the thirdsemiconductor layer of all pixels in series, and the electricity isapplied on the top conductive layer. Therefore, the first conductivepads receive the same electricity, and each pixel driver of the pixelscan control the first light emitting diode and the second light emittingdiode to emit lights through the second conductive pad and the thirdconductive pad.

Please refer to FIG. 5. FIG. 5 is a cross-sectional diagram illustratingthe two pixels 11 of the double color micro LED display panel accordingto the embodiment of FIG. 2. In this embodiment, the double color microLED display panel further includes a plurality of reflective components121 respectively disposed on the first conductive pads 141. In practice,the reflective component 121 may be a triangular reflective prism. Thereflective component 121 can be corresponding to the first lightemitting diode and the second light emitting diode. The surface ofreflective structure can be formed a reflective layer to reflect thefirst light and the second light. Therefore, the reflective component121 can reflect the lights to block the lights emitted from the one ofthe pixels to another of the pixels, thereby increasing the displayefficiency and reducing the light crosstalk. In addition, the reflectivecomponent 121 can reflect the first light and the second light to acertain direction according to the angle of the triangular prism. Thecertain direction can be perpendicular and away from the substrate 110.That is to say, the certain direction is the direction in which thepixel 11 emits light. When the first light and the second light areemitted from the side of the first light emitting diode and the secondlight emitting diode, the first light and the second light pass throughthe insulation layer 116 and the top conductive layer 117 to thereflective component 121. Then, the reflective component 121 changes thedirection of the first light and the second light in the certaindirection. Therefore, the reflective component 121 can change thedirection of the first light and the second light to increase the lightoutput rate, thereby increasing the display efficiency.

Please refer to FIG. 6. FIG. 6 is a cross-sectional diagram illustratingthe two pixels 11 of the double color micro LED display panel accordingto the embodiment of FIG. 2. In this embodiment, the double color microLED display panel further includes a plurality of optical isolationcomponents 122 respectively disposed on the first conductive pads 141.In practice, the optical isolation component 122 may include a lightabsorbing material formed on the surface of the optical isolationcomponent 122. The light absorbing material can absorb the certainwavelength of light or certain color. For example, the first light is agreen light, and the second light is a blue light. The optical isolationcomponent 122 can absorb the green light and the blue light. In oneembodiment, two light absorbing materials are formed on the differentpositions of the optical isolation component 122. The green lightabsorbing material is formed on the portion of the optical isolationcomponent 122 corresponding to the first light emitting diode to absorbthe first light, and blue light absorbing material is formed on theportion of the optical isolation component 122 corresponding to thesecond light emitting diode to absorb the second light. Therefore, theoptical isolation component 122 can absorb and block the light emittedfrom the one of the pixels to another of the pixels to reduce the lightcrosstalk, thereby increasing the display efficiency and the resolution.

Please refer to FIG. 7. FIG. 7 is a cross-sectional diagram illustratingthe two pixels 21 of the double color micro LED display panel accordingto another embodiment of the present invention. The difference of thisembodiment and the aforementioned embodiment is that the pixels 21 ofthe double color micro LED display panel do not include the topconductive layer. Furthermore, the first conductive pad 241 isconfigured on the substrate 210, and the pixel 21 further includes asecond connecting structure 2152. As shown in FIG. 7, the firstconductive pad 241, the second conductive pad 242 and the thirdconductive pad 243 are configured on the substrate 210. The firstconnecting structure 2151 is connected to the second semiconductor layer212 and the second conductive pad 242, and the second connectingstructure 2152 is connected to the third semiconductor layer 213 and thefirst conductive pad 241. In practice, the material of the secondconnecting structure 2152 is the same as the first connecting structure2151. The first conductive pads 241 is an N-electrode, and the secondconductive pad 242 and the third conductive pad 243 are P-electrodes.Therefore, the second light emitting diode formed by the secondsemiconductor layer 212 and the third semiconductor layer 213 can emitthe second light.

Furthermore, each of the pixels 21 also can include the bonding layer218 configured between the substrate 210 and the first semiconductorlayer 211 and electrically connected to the first semiconductor layer211 and the third conductive pad 243. Therefore, the first lightemitting diode formed by the first semiconductor layer 211 and the thirdsemiconductor layer 213 can emit the first light. The function of thebonding layer in this embodiment is the same as that of theaforementioned embodiments, it will be not described herein.

Moreover, each of the pixels 21 also can include the pixel driver 25connected to the first conductive pad 241, the second conductive pad 242and the third conductive pad 243. Similarly, the pixel driver 25 canselectively apply the electricity to the first conductive pad 241, thesecond conductive pad 242 and the third conductive pad 243 to controlthe first light emitting diode and the second light emitting diode toemit lights.

Please refer to FIG. 8. FIG. 8 is a cross-sectional diagram illustratingthe two pixels 21 of the double color micro LED display panel accordingto the embodiment of FIG. 7. In this embodiment, the double color microLED display panel further includes a plurality of reflective components221 respectively disposed on the insulation layer 216 between two of thepixels 21 to reflect the first light and the second light emitted fromthe first light emitting diode and the second light emitting diode to acertain direction. The function of the reflective component 221 in thisembodiment is the same as that of the aforementioned embodiments, itwill be not described herein. Please refer to FIG. 9. FIG. 9 is across-sectional diagram illustrating the two pixels 21 of the doublecolor micro LED display panel according to the embodiment of FIG. 7. Inthis embodiment, the double color micro LED display panel furtherincludes a plurality of optical isolation components 222 respectivelydisposed on the insulation layer 216 between two of the pixels 21 toblock the first light and the second light emitted from one of thepixels to the other of the pixels. The function of optical isolationcomponent 222 in this embodiment is the same as that of theaforementioned embodiments, it will be not described herein.

Please refer to FIG. 10. FIG. 10 is a cross-sectional diagramillustrating the two pixels 21 of the double color micro LED displaypanel according to another one embodiment. In this embodiment, theoptical isolation component 222 is configured on the substrate and theisolation layer 216 is configured on the optical isolation component222. Furthermore, the second connecting structure 2152 connects to theoptical isolation component 222, and the optical isolation component 222connects to the first conductive pad 241. In practice, the material ofthe optical isolation structure 222 may be a conductive material, andthe optical isolation structure 222 includes the light absorbingmaterial formed on the surface of the optical isolation structure 222.The first conductive pad 241 is an N-electrode, and the secondconductive pad 242 and the third conductive pad 243 are P-electrodes. Itshould be noted that the configuration of the second connectingstructure is not limited herein. In one embodiment, the first connectingstructure and the bonding layer are connected to the optical isolationcomponent, and the optical isolation component connects to the secondconductive pad (not shown in figure). Similarly, the position of theoptical isolation structure can be changed to the reflective component.

In one embodiment, the third semiconductor layer connects to the opticalisolation component directly, and the optical isolation componentconnects to the first conductive pad. In one embodiment, the firstsemiconductor layer and the second semiconductor layer connect to theoptical isolation component directly, and the optical isolationcomponent connects to the second conductive pad. Similarly, the positionof the optical isolation structure can be change to the reflectivecomponent.

In summary, the double color micro LED display panel of the presentinvention can include two light emitting diodes which emit differentcolors in one pixel, thereby increasing the light emitting efficiencyand reducing the volume. The reflective component and the opticalisolation component can effectively block the light emitted from onepixel to another of pixels to reduce the light crosstalk, therebyincreasing the display efficiency and the resolution. Moreover, thereflective component can reflect the lights to increase the light outputrate, which improves the display efficiency.

With the examples and explanations mentioned above, the features andspirits of the invention are hopefully well described. More importantly,the present invention is not limited to the embodiment described herein.Those skilled in the art will readily observe that numerousmodifications and alterations of the device may be made while retainingthe teachings of the invention. Accordingly, the above disclosure shouldbe construed as limited only by the metes and bounds of the appendedclaims.

What is claimed is:
 1. A double color micro LED display panel,comprising: a plurality of pixels, each of the pixels comprising: asubstrate; a first semiconductor layer configured on the substrate, thefirst semiconductor layer being P type; a second semiconductor layerconfigured on the first semiconductor layer, the second semiconductorlayer being P type; and a third semiconductor layer, configured betweenthe first semiconductor layer and the second semiconductor layer, thethird semiconductor layer being N type; wherein, the first semiconductorlayer and the third semiconductor layer form a first light emittingdiode to emit a first light, and the second semiconductor layer and thethird semiconductor form a second light emitting diode to emit a secondlight.
 2. The double color micro LED display panel of claim 1, whereineach of the pixels comprises an insulation layer, the insulation layercovers the top surface and side wall of the second semiconductor layer,the side wall of the first semiconductor layer and the thirdsemiconductor layer, and the surface of the substrate; a portion of thethird semiconductor layer is exposed from the insulation layer, and theinsulation layer extends to the position between two of the pixels. 3.The double color micro LED display panel of claim 2, wherein each of thepixels comprises a first conductive pad, a second conductive pad, afirst connecting structure and a second connecting structure, the firstconductive pad and the second conductive pad are configured on thesubstrate, the first connecting structure is electrically connected tothe second semiconductor layer and the second conductive pad, and thesecond connecting structure is electrically connected to the thirdsemiconductor layer and the first conductive pad.
 4. The double colormicro LED display panel of claim 3, wherein each of the pixels comprisesa third conductive pad configured on the substrate and a bonding layerconfigured between the substrate and the first light emitting diode, thebonding layer is electrically connected to the first semiconductor layerand the third conductive pad.
 5. The double color micro LED displaypanel of claim 4, further comprising a plurality of pixel driversrespectively configured on the substrate of the pixels, the pixel driverbeing electrically connected to the first conductive pad, the secondconductive pad and the third conductive pad, and the pixel drivercontrolling the first light emitting diode and the second light emittingdiode to emit lights respectively.